Solid-state imaging device

ABSTRACT

A solid-state imaging device includes a substrate, a photoelectric conversion section, a first impurity layer having a carrier polarity of a second conductivity type, a charge-to-voltage converting section, an amplifying section, and a second impurity layer having a carrier polarity of the second conductivity type. The second impurity layer is disposed in a region between the photoelectric conversion section and the amplifying section. The second impurity concentration of the second P-type impurity layer is made higher than the first impurity concentration of the first impurity layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of U.S. patentapplication Ser. No. 14/688,133, filed Apr. 16, 2015, which is acontinuation application of U.S. patent application Ser. No. 14/145,256,filed Dec. 31, 2013, now U.S. Pat. No. 9,029,926, issued May 12, 2015,which is a continuation application of U.S. patent application Ser. No.13/372,619, filed Feb. 14, 2012, now U.S. Pat. No. 8,633,524, issuedJan. 21, 2014, and claims the benefit of priority from prior Japanesepatent application JP 2011-045329, filed Mar. 2, 2011, the entirecontent of which is hereby incorporated by reference.

BACKGROUND

The present disclosure relates to a solid-state imaging device.

In related art, solid-state imaging devices fabricated by formingvarious elements such for example as MOS (Metal-Oxide-Semiconductor)transistors and photodiodes (light receiving sections) on asemiconductor substrate are used in various technical fields. In such asolid-state imaging device, for example, a diffused region formed by animpurity layer of an N-type carrier polarity, a source/drain region of aMOS transistor, and the like are formed on an impurity layer of a P-typecarrier polarity (which impurity layer will hereinafter be referred toas a P-type well).

In the solid-state imaging device of the constitution as describedabove, carriers flow out from peripheral parts of the source/drainregion and the diffused region to the light receiving sections via theP-type well, thereby increasing dark current and thus degrading imagequality. Accordingly, various techniques have been proposed in the pastto solve this problem (see Japanese Patent Laid-Open Nos. 2001-156280and 2006-24907 (hereinafter referred to as Patent Documents 1 and 2),for example).

Patent Document 1 proposes a technique for remedying the outflow ofcarriers to adjacent pixels by making the impurity concentration of aP-type well forming the source/drain region of a MOS transistor higherthan the impurity concentration of a P-type well forming a lightreceiving section. In addition, Patent Document 2 proposes a techniquefor reducing dark current by providing a P+ guard layer between an N+region of a photoelectric conversion section (light receiving section)and an N+ region forming a source/drain region of a MOS transistor, theN+ regions being formed on a P-type well.

SUMMARY

While various techniques for reducing dark current in solid-stateimaging devices have been proposed in the past as described above, thereis a desire for the development of a technique for further reducing darkcurrent in this technical field. The present disclosure has been made inview of the above situation. It is desirable to provide a solid-stateimaging device capable of further reducing dark current.

A solid-state imaging device according to an embodiment of the presentdisclosure includes a substrate, a photoelectric conversion section, afirst impurity layer, a charge-to-voltage converting section, anamplifying section, and a second impurity layer. The constitutions andfunctions of the respective parts and the respective layers are asfollows. The photoelectric conversion section is disposed on thesubstrate, includes an impurity region having a carrier polarity of afirst conductivity type, and converts incident light into a signalcharge. The first impurity layer is disposed on the substrate, has acarrier polarity of a second conductivity type opposite from the firstconductivity type, and has a first impurity concentration. Thecharge-to-voltage converting section is disposed on the first impuritylayer, includes an impurity region having a carrier polarity of thefirst conductivity type, and converts the signal charge converted by thephotoelectric conversion section into voltage. The amplifying section isdisposed on the first impurity layer, has a source/drain region with acarrier polarity of the first conductivity type, and amplifies thevoltage converted by the charge-to-voltage converting section. Thesecond impurity layer is disposed in a region between the photoelectricconversion section and the amplifying section, has a carrier polarity ofthe second conductivity type, and has a second impurity concentrationhigher than the first impurity concentration.

As described above, the solid-state imaging device according to theembodiment of the present disclosure includes the second impurity layerof the second conductivity type in the region between the amplifyingsection having the source/drain region of the first conductivity typewhich source/drain region is formed on the first impurity layer of thesecond conductivity type and the photoelectric conversion sectionincluding the impurity region of the first conductivity type. The secondimpurity concentration of the second impurity layer is made higher thanthe first impurity concentration of the first impurity layer. Thus, thesolid-state imaging device according to the embodiment of the presentdisclosure can further reduce dark current by suppressing the outflow ofcarriers occurring in a region on the substrate side of the source/drainregion to the photoelectric conversion section.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an equivalent circuit diagram showing an example of aconfiguration of a pixel;

FIG. 2 is a diagram showing an example of a schematic constitution ofthe vicinity of photoelectric conversion sections in a solid-stateimaging device according to a first embodiment;

FIG. 3 is a sectional view taken along a line A-A of FIG. 2;

FIG. 4 is a diagram showing an example of a schematic constitution ofthe vicinity of photoelectric conversion sections in a solid-stateimaging device according to a second embodiment;

FIG. 5 is a sectional view taken along a line B-B of FIG. 4;

FIG. 6 is a diagram showing an example of a schematic constitution ofthe vicinity of photoelectric conversion sections in a solid-stateimaging device according to a third embodiment;

FIG. 7 is a sectional view taken along a line C-C of FIG. 6;

FIG. 8 is a sectional view taken along a line D-D of FIG. 6;

FIG. 9 is a diagram showing an example of a schematic constitution ofthe vicinity of photoelectric conversion sections in a solid-stateimaging device according to a fourth embodiment; and

FIG. 10 is a sectional view taken along a line E-E of FIG. 9.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An example of solid-state imaging devices according to preferredembodiments of the present disclosure will hereinafter be described inthe following order with reference to the drawings. However, the presentdisclosure is not limited to the following example.

-   1. First Embodiment: Example of Basic Constitution-   2. Second Embodiment: Example of Disposing Third P-Type Impurity    Layer in Region between Photoelectric Conversion Section and    Charge-to-Voltage Converting Section-   3. Third Embodiment: Example of Disposing Diffusion Isolation Layer    in Region between Photoelectric Conversion Sections Adjacent to Each    Other-   4. Fourth Embodiment: Example of Forming Second P-Type Impurity    Layer within First P-Type Impurity Layer

1. First Embodiment Schematic Constitution of Pixel

A solid-state imaging device for example includes a pixel array section(not shown) formed by arranging a plurality of pixels two-dimensionally(in the form of an array). FIG. 1 shows an example of an equivalentcircuit of each pixel forming the pixel array section. A pixel 1 in theexample shown in FIG. 1 includes a photoelectric conversion section 10,a transfer section 11, a reset section 12, an amplifying section 13, aselecting section 14, and a charge-to-voltage converting section 20.

The photoelectric conversion section 10 is formed by a photodiode (PD),for example. The photoelectric conversion section 10 converts incidentlight into a signal charge. Incidentally, the photoelectric conversionsection 10 has an anode electrode connected to a negative side powersupply (for example a ground), and has a cathode electrode electricallyconnected to the gate of the amplifying section 13 via the transfersection 11.

The transfer section 11 is for example formed by a MOS transistor of anN-type carrier polarity (which MOS transistor will hereinafter bereferred to as an NMOS transistor). The transfer section 11 is disposedbetween the cathode electrode of the photoelectric conversion section 10and the charge-to-voltage converting section 20. The transfer section 11is set in an on state when a high-level transfer pulse Vt is applied tothe gate of the transfer section 11, and transfers the signal chargeresulting from photoelectric conversion in the photoelectric conversionsection 10 to the charge-to-voltage converting section 20.

The reset section 12 is for example formed by an NMOS transistor. Thereset section 12 is disposed between the charge-to-voltage convertingsection 20 and a power supply line PL. The reset section 12 is set in anon state when a high-level reset pulse Vr is applied to the gate of thereset section 12. This operation is performed before the operation oftransferring the signal charge from the photoelectric conversion section10 to the charge-to-voltage converting section 20. Thereby, the signalcharge of the charge-to-voltage converting section 20 is discarded tothe power supply line PL to reset the charge-to-voltage convertingsection 20.

The amplifying section 13 is for example formed by an NMOS transistor.The amplifying section 13 is disposed between the power supply line PLand the drain of the selecting section 14. The amplifying section 13outputs the potential of the charge-to-voltage converting section 20after being reset by the reset section 12 as a reset signal (resetlevel) to the selecting section 14. In addition, the amplifying section13 amplifies the potential of the charge-to-voltage converting section20 after the transfer of the signal charge from the photoelectricconversion section 10 to the charge-to-voltage converting section 20,and outputs the amplified signal as a light accumulation signal (pixelsignal) to the selecting section 14.

The selecting section 14 is for example formed by an NMOS transistor.The selecting section 14 is disposed between the source of theamplifying section 13 and a vertical signal line VL. The selectingsection 14 is set in an on state when a high-level selecting pulse Vs isapplied to the gate of the selecting section 14. The pixel 1 is therebyset in a selected state. In the selected state, the selecting section 14relays the pixel signal output from the amplifying section 13 to thevertical signal line VL. Incidentally, the arrangement position of theselecting section 14 is not limited to the example shown in FIG. 1. Theselecting section 14 may be disposed between the power supply line PLand the drain of the amplifying section 13.

The charge-to-voltage converting section 20 (FD: floating diffusion) isformed at a node where the source of the transfer section 11 and thegate of the amplifying section 13 are electrically connected to eachother. The charge-to-voltage converting section 20 converts the signalcharge converted by the photoelectric conversion section 10 into avoltage (potential). Incidentally, a more detailed constitution of thecharge-to-voltage converting section 20 will be described later.

In the above-described example of FIG. 1, the pixel 1 is formed withfour NMOS transistors. However, the present disclosure is not limited tothis. An arbitrary constitution can be formed as long as theconstitution is configured so as to be able to output a chargeaccumulated in the pixel 1 as an electric signal to the vertical signalline VL provided for each column. For example, one NMOS transistor mayserve as the amplifying section 13 and the selecting section 14, and thepixel 1 may be formed with three NMOS transistors.

[Constitution in Vicinity of Photoelectric Conversion Section]

When the pixel 1 of the constitution shown in FIG. 1 is actually formedon a semiconductor substrate, the respective parts formed by the NMOStransistors (the transfer section 11, the reset section 12, theamplifying section 13, and the selecting section 14) and thecharge-to-voltage converting section 20 are formed on the periphery ofthe photoelectric conversion section 10, for example.

FIG. 2 and FIG. 3 show a schematic constitution of parts in the vicinityof the photoelectric conversion section 10 in the solid-state imagingdevice according to the present embodiment. FIG. 2 is a schematicdiagram of an arrangement of the parts in the vicinity of thephotoelectric conversion section 10 in a light receiving surface of thesolid-state imaging device 100 according to the present embodiment. FIG.3 is a sectional view taken along a line A-A of FIG. 2.

However, in order to simplify description, FIG. 2 and FIG. 3 show onlyprincipal parts involved in an effect of suppressing dark current in thesolid-state imaging device 100 according to the present embodiment. Inaddition, to simplify description, FIG. 2 and FIG. 3 show a schematicconstitution of a laminated region from the semiconductor substrate to asurface in which the source/drain region of an NMOS transistor isformed. In addition, to simplify description, FIG. 2 shows only a regionof four pixels 1 adjacent to each other in a column direction and a rowdirection in the pixel array section (not shown). Further, for moreclarification of the internal structure of the parts in the vicinity ofthe photoelectric conversion section 10, dimensions of the parts in thevicinity of the photoelectric conversion section 10 and dimensionsbetween the parts in FIG. 3 are changed from those dimensions in FIG. 2.Incidentally, the above-described display method for simplifyingdescription in FIG. 2 and FIG. 3 will be similarly applied in FIGS. 4 to10 to be used in description later of a second to a fourth embodiment.

In addition, in FIG. 2 and FIG. 3, directions within the light receivingsurface of the solid-state imaging device 100 will be represented by afirst direction (X-direction) and a second direction (Y-direction)orthogonal to the first direction, and a direction of thickness of anN-type semiconductor substrate 101 to be described later (direction ofdepth of the solid-state imaging device 100) will be represented by aZ-direction. Incidentally, the definition of these directions in thepresent embodiment (FIG. 2 and FIG. 3) will be similarly applied inFIGS. 4 to 10 to be used in description later of the second to fourthembodiments.

(1) Constitution of Solid-State Imaging Device

The solid-state imaging device 100 includes an N-type semiconductorsubstrate 101 (substrate) and a P-type epitaxial layer 102 formed on theN-type semiconductor substrate 101. The solid-state imaging device 100also includes a photoelectric conversion section 10, a first P-typeimpurity layer 51 (first impurity layer, which will hereinafter bereferred to as a first P-type well 51), and a second P-type impuritylayer 52 (second impurity layer, which will hereinafter be referred toas a second P-type well 52), the photoelectric conversion section 10,the first P-type well 51, and the second P-type well 52 being formed onthe P-type epitaxial layer 102.

The solid-state imaging device 100 further includes a charge-to-voltageconverting section 20 and a source/drain region section 30 (S/D: asource/drain region) of an NMOS transistor, the charge-to-voltageconverting section 20 and the source/drain region section 30 beingformed on the first P-type well 51. The solid-state imaging device 100also includes an element isolation region section 40 (element isolationlayer) disposed in a region between the photoelectric conversion section10 and the source/drain region section 30. Incidentally, thesource/drain region section 30 shown in FIG. 2 and FIG. 3 is thesource/drain region section of the amplifying section 13 in FIG. 1.

In the solid-state imaging device 100 according to the presentembodiment, as shown in FIG. 2, the charge-to-voltage converting section20 is formed in such a position as to be opposed to the source/drainregion section 30 with the photoelectric conversion section 10interposed between the charge-to-voltage converting section 20 and thesource/drain region section 30 along the Y-direction. Incidentally, thearrangement position of the source/drain region section 30 is notlimited to the example shown in FIG. 2. For example, the source/drainregion section 30 may be disposed in a part on a side of thephotoelectric conversion section 10 in the X-direction in FIG. 2 (parton a left side or a right side in FIG. 2). In addition, in the presentembodiment, the charge-to-voltage converting section 20 is disposed in aregion between photoelectric conversion sections 10 adjacent to eachother in the Y-direction in FIG. 2, and two pixels 1 share onecharge-to-voltage converting section 20. However, the present disclosureis not limited to this. A charge-to-voltage converting section 20 may beprovided for each pixel 1.

Further, in the solid-state imaging device 100 according to the presentembodiment, as shown in FIG. 2, a plurality of photoelectric conversionsections 10 are arranged in one row along the X-direction, a pluralityof charge-to-voltage converting sections 20 are arranged in one rowalong the X-direction, and a plurality of source/drain region sections30 are arranged in one row along the X-direction.

(2) Constitution of Parts

The photoelectric conversion section 10 has an impurity layer 10 a of anN-type (first conductivity type) carrier polarity (which impurity layeris an impurity region, and will hereinafter be referred to as an N-typeimpurity layer 10 a). The photoelectric conversion section 10 also has apinning layer 10 b of a P-type (second conductivity type) carrierpolarity (which pinning layer will hereinafter be referred to as aP-type pinning layer 10 b) which pinning layer is formed on a surface(upper surface in FIG. 3) of the N-type impurity layer 10 a whichsurface is on an opposite side from the side of the N-type semiconductorsubstrate 101. The photoelectric conversion section 10 further includesa P-type impurity layer 10 c formed on a side surface (right sidesurface in FIG. 3) of the N-type impurity layer 10 a which side surfaceis on an opposite side from the side of the source/drain region section30. Incidentally, dark current in the surface of the photoelectricconversion section 10 (light receiving section) can be suppressed byforming the P-type pinning layer 10 b in the surface of thephotoelectric conversion section 10.

The charge-to-voltage converting section 20 is formed by ahigh-concentration N-type impurity layer (impurity region).Incidentally, though not shown in FIG. 2 or FIG. 3, in the presentembodiment, a depletion layer is formed at a boundary between thecharge-to-voltage converting section 20 and the first P-type well 51(see FIG. 5 for a second embodiment to be described later).

The source/drain region section 30 is formed by a high-concentrationN-type impurity layer. Incidentally, in the present embodiment, as shownin FIG. 3, a depletion layer 31 is formed at a boundary between thesource/drain region section 30 and the first P-type well 51.

The element isolation region section 40 is formed by an LOCOS (localoxidation of silicon) or STI (shallow trench isolation) technique. Inaddition, in the example shown in FIG. 2, the element isolation regionsection 40 is formed so as to surround the periphery of the source/drainregion section 30.

Incidentally, in the present embodiment, an element isolation regionsection formed by a technique such for example as LOCOS or STI may beprovided also to a region between photoelectric conversion sections 10adjacent to each other along the X-direction in FIG. 2 in order toseparate the adjacent photoelectric conversion sections 10 from eachother. Alternatively, a diffusion isolation region section formed by amethod of diffusion isolation may be formed in the region between thephotoelectric conversion sections 10 adjacent to each other along theX-direction in FIG. 2.

The first P-type well 51 is formed by a P-type impurity layer having ahigher impurity concentration P1 (first impurity concentration) than theimpurity concentration of the P-type epitaxial layer 102. Incidentally,the first P-type well 51 disposed in a region of the charge-to-voltageconverting section 20 on the side of the N-type semiconductor substrate101 (which region will hereinafter be referred to as a lower part) andthe first P-type well 51 disposed in the lower part of the source/drainregion section 30 may be connected to each other, or may be disposedseparately from each other. In addition, while description in thepresent embodiment has been made of an example in which the first P-typewell 51 is provided in the lower parts of the charge-to-voltageconverting section 20 and the source/drain region section 30, thepresent disclosure is not limited to this. For example, the first P-typewell 51 may be formed over the entire surface of the N-typesemiconductor substrate 101, and not only the charge-to-voltageconverting section 20 and the source/drain region section 30 but alsothe photoelectric conversion section 10 may be formed on the firstP-type well 51.

The second P-type well 52 is formed by a P-type impurity layer having ahigher impurity concentration P2 (second impurity concentration: P2>P1)than the impurity concentration P1 of the first P-type well 51.Incidentally, the impurity concentration P2 of the second P-type well 52can be higher than the impurity concentration P1 of the first P-typewell 51 by at least about 25%, for example. However, a ratio between theimpurity concentration P1 of the first P-type well 51 and the impurityconcentration P2 of the second P-type well 52 is not limited to this,but is set appropriately according to conditions such as a use, forexample. In addition, while the second P-type well 52 is generallyformed by a technique of ion implantation, for example, the presentdisclosure is not limited to this. The second P-type well 52 may beformed by a technique of selective epitaxial growth, for example.

In addition, as shown in FIG. 3, the second P-type well 52 is formed inthe lower part of the element isolation region section 40. Specifically,in the present embodiment, the second P-type well 52 is formed in aregion between the source/drain region section 30 (and the first P-typewell 51 disposed in the lower part of the source/drain region section30) and the photoelectric conversion section 10. Incidentally, in thepresent embodiment, the second P-type well 52 is formed so as tosurround the periphery of the source/drain region section 30.

Further, the second P-type well 52 is formed so as to span a region froma surface of the element isolation region section 40 on the side of theN-type semiconductor substrate 101 (which surface will hereinafter bereferred to as a lower surface) to a deep position in the first P-typewell 51 (position nearer to the N-type semiconductor substrate 101) inthe Z-direction in FIG. 3. Incidentally, FIG. 3 shows an example inwhich the second P-type well 52 is formed in a region from the lowersurface of the element isolation region section 40 to a position deeperthan the lower surface of the N-type impurity layer 10 a of thephotoelectric conversion section 10.

Because the second P-type well 52 of the above-described constitution isdisposed in a region approximately as narrow as the width of the elementisolation region section 40, a PN junction surface having a steepconcentration gradient of a P-type impurity is formed at a boundarybetween the photoelectric conversion section 10 and the source/drainregion section 30. That is, a barrier for carriers occurring in thelower part (lower region) of the source/drain region section 30 isformed at the boundary between the photoelectric conversion section 10and the source/drain region section 30.

As a result, the present embodiment can suppress the outflow of carriersoccurring in the lower part of the source/drain region section 30 to theN-type impurity layer 10 a of the photoelectric conversion section 10through the lower part of the element isolation region section 40. Thatis, the solid-state imaging device 100 according to the presentembodiment can further reduce dark current.

The above-described effect of reducing dark current in the solid-stateimaging device 100 according to the present embodiment will be describedin the following more concretely by comparison with the technique forreducing dark current which technique is proposed in the above-describedPatent Document 1, for example.

In the above Patent Document 1, as described above, the outflow ofcarriers to an adjacent pixel is suppressed by making the impurityconcentration of a P-type well forming the source/drain region of a MOStransistor higher than the impurity concentration of a P-type wellforming a light receiving section. With this constitution, however,carriers occurring in a lower region of the source/drain region cannotbe sufficiently absorbed in a high-concentration N-type impurity regionof the source/drain region. Thus, the technique proposed in the abovePatent Document 1 cannot sufficiently suppress the outflow of carriersoccurring in the lower part of the source/drain region to the lightreceiving section, and has difficulty in reducing dark current.

On the other hand, as described above, in the present embodiment, thesecond P-type well 52 of high impurity concentration is provided in theregion between the source/drain region section 30 and the photoelectricconversion section 10, and thereby a barrier for carriers is formed inthe region. Therefore, the present embodiment makes it difficult forcarriers occurring at a deep position in the lower part of thesource/drain region section 30 to flow out to the photoelectricconversion section 10 due to the barrier formed in the region betweenthe source/drain region section 30 and the photoelectric conversionsection 10, and is thus able to further reduce dark current.

Incidentally, while description has been made of an example in which thesecond P-type well 52 is formed so as to surround the periphery of thesource/drain region section 30 in the above-described solid-stateimaging device 100 according to the present embodiment, the presentdisclosure is not limited to this. For example, it suffices to disposethe second P-type well 52 at least in the region between thephotoelectric conversion section 10 and the source/drain region section30. However, the outflow of carriers occurring in the lower part of thesource/drain region section 30 to the photoelectric conversion section10 can be suppressed more when the second P-type well 52 surrounds theperiphery of the source/drain region section 30 as in the presentembodiment.

In addition, the above description has been made of an example in whichthe position of the lower surface of the second P-type well 52 (surfaceon the side of the N-type semiconductor substrate 101) is deeper thanthe position of the lower surface of the N-type impurity layer 10 a inthe photoelectric conversion section 10 (is positioned on the side ofthe N-type semiconductor substrate 101). However, the present disclosureis not limited to this. The depth of the second P-type well 52(thickness in the Z-direction of the second P-type well 52) can be setarbitrarily as long as the second P-type well 52 has such a depth as tosufficiently suppress the outflow of carriers from the lower part of thesource/drain region section 30 to the photoelectric conversion section10.

For example, the second P-type well 52 may be formed such that the lowersurface of the second P-type well 52 reaches the N-type semiconductorsubstrate 101. In the present embodiment, however, it sufficesprincipally to be able to suppress the outflow of carriers from thefirst P-type well 51 in the lower part of the source/drain regionsection 30 to the photoelectric conversion section 10. Thus, in thepresent embodiment, the above-described effect of suppressing theoutflow of carriers can be obtained sufficiently by forming the secondP-type well 52 so as to span the depth region from the position of thelower surface of the element isolation region section 40 to about theposition in the vicinity of the lower surface of the first P-type well51. That is, it suffices for a distance between the lower surface of thesecond P-type well 52 and the N-type semiconductor substrate 101 to beequal to or greater than a distance between the lower surface of thefirst P-type well 51 and the N-type semiconductor substrate 101 in theZ-direction in FIG. 3 (direction of thickness of the N-typesemiconductor substrate 101).

<2. Second Embodiment>

In a second embodiment, description will be made of an example in whicha P-type well having a higher impurity concentration than a first P-typewell 51 is provided in not only a region between a photoelectricconversion section 10 and a source/drain region section 30 but also aregion between the photoelectric conversion section 10 and acharge-to-voltage converting section 20.

FIG. 4 and FIG. 5 show a schematic constitution of parts in the vicinityof a photoelectric conversion section 10 in a solid-state imaging deviceaccording to a second embodiment. Incidentally, FIG. 4 is a schematicdiagram of an arrangement of the parts in the vicinity of thephotoelectric conversion section 10 in a light receiving surface of thesolid-state imaging device 110 according to the present embodiment (inan XY plane in FIG. 4). FIG. 5 is a sectional view taken along a lineB-B of FIG. 4. In the solid-state imaging device 110 according to thepresent embodiment shown in FIG. 4 and FIG. 5, similar constituentelements to those of the solid-state imaging device 100 according to theforegoing first embodiment shown in FIG. 2 and FIG. 3 are identified bythe same reference numerals.

(1) Constitution of Solid-State Imaging Device

The solid-state imaging device 110 includes an N-type semiconductorsubstrate 101 and a P-type epitaxial layer 102 formed on the N-typesemiconductor substrate 101, as in the foregoing first embodiment. Thesolid-state imaging device 110 also includes a photoelectric conversionsection 10, a first P-type well 51, and a third P-type impurity layer 53(third impurity layer, which will hereinafter be referred to as a thirdP-type well 53), the photoelectric conversion section 10, the firstP-type well 51, and the third P-type well 53 being formed on the P-typeepitaxial layer 102.

The solid-state imaging device 110 further includes a charge-to-voltageconverting section 20 and a source/drain region section 30 of an NMOStransistor, the charge-to-voltage converting section 20 and thesource/drain region section 30 being formed on the first P-type well 51,as in the foregoing first embodiment. The solid-state imaging device 110also includes an element isolation region section 40 disposed in aregion between the photoelectric conversion section 10 and thesource/drain region section 30, as in the foregoing first embodiment.Incidentally, the source/drain region section 30 shown in FIG. 4 is thesource/drain region section of the amplifying section 13 in FIG. 1.

In addition, in the present embodiment, the third P-type well 53 isdisposed in a region between the photoelectric conversion section 10 andthe charge-to-voltage converting section 20. Incidentally, in theexample shown in FIG. 5, a depletion layer 21 is formed at a boundarybetween the charge-to-voltage converting section 20 and the first P-typewell 51. In FIG. 4, however, the depletion layer 21 is not shown inorder to simplify description.

As is clear from comparison between FIG. 4 and FIG. 2, the arrangementand constitution of the photoelectric conversion section 10, thecharge-to-voltage converting section 20, the source/drain region section30, and the element isolation region section 40 in the light receivingsurface of the solid-state imaging device 110 (in the XY plane in FIG.4) are similar to those of the foregoing first embodiment. In addition,though not shown in FIG. 5, an internal constitution of a region betweenthe photoelectric conversion section 10 and the source/drain regionsection 30 (constitution of the lower part of the element isolationregion section 40) in a Z-direction in FIG. 5 (direction of thickness ofthe N-type semiconductor substrate 101) is similar to the constitution(FIG. 3) of the foregoing first embodiment.

That is, the solid-state imaging device 110 according to the presentembodiment has a constitution including the third P-type well 53 newlyprovided in a region between the photoelectric conversion section 10 andthe charge-to-voltage converting section 20 in the solid-state imagingdevice 100 according to the foregoing first embodiment. The otherconstitution is similar to the constitution of the foregoing firstembodiment. Description in the following will therefore be made only ofthe constitution and functions of the third P-type well 53.

(2) Constitution of Third P-Type Well

The third P-type well 53 is formed by a P-type impurity layer having animpurity concentration P3 (third impurity concentration: P1<P3≦P2)higher than the impurity concentration P1 of the first P-type well 51and nearly equal to or lower than the impurity concentration P2 of asecond P-type well 52. Incidentally, while the third P-type well 53 isgenerally formed by a technique of ion implantation, for example, thepresent disclosure is not limited to this. The third P-type well 53 maybe formed by a technique of selective epitaxial growth, for example.

In addition, as shown in FIG. 5, the third P-type well 53 is formed inthe region between the photoelectric conversion section 10 and thecharge-to-voltage converting section 20. Incidentally, in the presentembodiment, as shown in FIG. 4, the third P-type well 53 is formed so asto surround the periphery of the charge-to-voltage converting section20. However, the present disclosure is not limited to this. It sufficesat least to provide the third P-type well 53 in the region between thephotoelectric conversion section 10 and the charge-to-voltage convertingsection 20.

Further, the third P-type well 53 is formed so as to span a region froma same position as the position of the surface of the charge-to-voltageconverting section 20 to a deep position in the first P-type well 51(position nearer to the N-type semiconductor substrate 101) in theZ-direction in FIG. 5. Incidentally, FIG. 5 shows an example in whichthe third P-type well 53 is formed in a region from the same position asthe position of the surface of the charge-to-voltage converting section20 to a position deeper than the lower surface (surface on the side ofthe N-type semiconductor substrate 101) of an N-type impurity layer 10 ain the photoelectric conversion section 10.

The depth of the third P-type well 53 (thickness in the Z-direction inFIG. 5 of the third P-type well 53) is not limited to the example shownin FIG. 5. The depth of the third P-type well 53 can be set arbitrarilyas long as the third P-type well 53 has such a depth as to be able tosufficiently suppress the outflow of carriers from the lower part of thecharge-to-voltage converting section 20 to the photoelectric conversionsection 10.

For example, the third P-type well 53 may be formed such that the lowersurface of the third P-type well 53 reaches the N-type semiconductorsubstrate 101. In the present embodiment, however, it sufficesprincipally to be able to suppress the outflow of carriers from thefirst P-type well 51 in the lower part of the charge-to-voltageconverting section 20 to the photoelectric conversion section 10. Thus,in the present embodiment, the above-described effect of suppressing theoutflow of carriers can be obtained sufficiently by forming the thirdP-type well 53 so as to span the depth region from the position of thesurface of the charge-to-voltage converting section 20 to about theposition in the vicinity of the lower surface of the first P-type well51. That is, it suffices for a distance between the lower surface of thethird P-type well 53 and the N-type semiconductor substrate 101 to beequal to or greater than a distance between the lower surface of thefirst P-type well 51 and the N-type semiconductor substrate 101 in theZ-direction in FIG. 5 (direction of thickness of the N-typesemiconductor substrate 101).

As described above, in the present embodiment, the third P-type well 53having the impurity concentration P3 higher than that of the firstP-type well 51 is disposed in the region between the charge-to-voltageconverting section 20 (and the first P-type well 51 disposed in thelower part of the charge-to-voltage converting section 20) and thephotoelectric conversion section 10. Thereby, a barrier for carriersoccurring in the lower part (lower region) of the charge-to-voltageconverting section 20 is formed in the region between the photoelectricconversion section 10 and the charge-to-voltage converting section. As aresult, the present embodiment can suppress the outflow of carriersoccurring in the lower part of the charge-to-voltage converting section20 to the photoelectric conversion section 10.

That is, the solid-state imaging device 110 according to the presentembodiment can suppress not only the outflow of carriers occurring inthe lower region of the source/drain region section 30 to thephotoelectric conversion section 10 but also the outflow of carriersoccurring in the lower region of the charge-to-voltage convertingsection 20 to the photoelectric conversion section 10. Thus, thesolid-state imaging device 110 according to the present embodiment canfurther reduce dark current.

In addition, in the present embodiment, as described above, the impurityconcentration P3 of the third P-type well 53 is made nearly equal to orlower than the impurity concentration P2 of the second P-type well 52(P3≦P2). This is for the following reasons. For example, the NMOStransistor forming the transfer section 11 within the pixel 1 describedin FIG. 1 is disposed on the region between the photoelectric conversionsection 10 and the charge-to-voltage converting section 20, that is, onthe third P-type well 53, as shown in FIG. 5. Incidentally, FIG. 5 showsonly the transfer gate 11 a of the transfer section 11 in order tosimplify description.

That is, the surface region of the third P-type well 53 in thesolid-state imaging device 110 according to the present embodimentserves also as a transfer region at a time of transferring a signalcharge converted by the photoelectric conversion section 10 to thecharge-to-voltage converting section 20. Too high an impurityconcentration P3 of this transfer region can hinder the operation oftransferring the signal charge. Accordingly, in the present embodiment,the impurity concentration P3 of the third P-type well 53 is made nearlyequal to or lower than the impurity concentration P2 of the secondP-type well 52 to facilitate the transfer of the signal charge in thetransfer region.

<3. Third Embodiment>

In a third embodiment, description will be made of an example of aconstitution in which a photoelectric conversion section 10 and asource/drain region section 30 are separated from each other by anelement isolation region section 40 formed by LOCOS or STI andphotoelectric conversion sections 10 adjacent to each other areseparated from each other by diffusion isolation.

FIGS. 6 to 8 show a schematic constitution of parts in the vicinity of aphotoelectric conversion section 10 in a solid-state imaging deviceaccording to a third embodiment. Incidentally, FIG. 6 is a schematicdiagram of an arrangement of the parts in the vicinity of thephotoelectric conversion section 10 in a light receiving surface of thesolid-state imaging device 120 according to the present embodiment (inan XY plane in FIG. 6). FIG. 7 is a sectional view taken along a lineC-C of FIG. 6. FIG. 8 is a sectional view taken along a line D-D of FIG.6. In the solid-state imaging device 120 according to the presentembodiment shown in FIGS. 6 to 8, similar constituent elements to thoseof the solid-state imaging device 100 according to the foregoing firstembodiment shown in FIG. 2 and FIG. 3 are identified by the samereference numerals.

(1) Constitution of Solid-State Imaging Device

The solid-state imaging device 120 includes an N-type semiconductorsubstrate 101 and a P-type epitaxial layer 102 formed on the N-typesemiconductor substrate 101, as in the foregoing first embodiment. Thesolid-state imaging device 120 also includes a photoelectric conversionsection 10, a first P-type well 51, a second P-type well 52, and adiffusion isolation region section 60 (diffusion isolation layer), thephotoelectric conversion section 10, the first P-type well 51, thesecond P-type well 52, and the diffusion isolation region section 60being formed on the P-type epitaxial layer 102. Incidentally, thediffusion isolation region section 60 is disposed in a region betweenphotoelectric conversion sections 10 adjacent to each other in anX-direction in FIG. 6.

The solid-state imaging device 120 further includes a charge-to-voltageconverting section 20 and a source/drain region section 30 of an NMOStransistor, the charge-to-voltage converting section 20 and thesource/drain region section 30 being formed on the first P-type well 51,as in the foregoing first embodiment. The solid-state imaging device 120also includes an element isolation region section 40 disposed in aregion between the photoelectric conversion section 10 and thesource/drain region section 30, as in the foregoing first embodiment.Incidentally, the source/drain region section 30 shown in FIG. 6 andFIG. 7 is the source/drain region section of the amplifying section 13in FIG. 1.

As is clear from comparison between FIG. 6 and FIG. 2, the arrangementand constitution of the photoelectric conversion section 10, thecharge-to-voltage converting section 20, the source/drain region section30, and the element isolation region section 40 in the light receivingsurface of the solid-state imaging device 120 (in the XY plane in FIG.6) are similar to those of the foregoing first embodiment. In addition,as is clear from comparison between FIG. 7 and FIG. 3, an internalconstitution of a region between the photoelectric conversion section 10and the source/drain region section 30 (constitution of the lower partof the element isolation region section 40) in a Z-direction in FIG. 7is also similar to the constitution (FIG. 3) of the foregoing firstembodiment.

That is, the solid-state imaging device 120 according to the presentembodiment has a constitution including the diffusion isolation regionsection 60 newly provided in the region between the photoelectricconversion sections 10 adjacent to each other in the solid-state imagingdevice 100 according to the foregoing first embodiment. The otherconstitution is similar to the constitution of the foregoing firstembodiment. Description in the following will therefore be made only ofthe constitution and functions of the diffusion isolation region section60.

(2) Constitution of Diffusion Isolation Region Section

The diffusion isolation region section 60 is formed by a P-type impuritylayer. The diffusion isolation region section 60 is formed by atechnique of ion implantation, for example. Incidentally, the impurityconcentration of the diffusion isolation region section 60 is set higherthan the impurity concentration of the P-type epitaxial layer 102.

The diffusion isolation region section 60 is formed so as to span aregion from a same position as the position of the surfaces of thephotoelectric conversion sections 10 to a same position as the lowersurface of an N-type impurity layer 10 a (surface on the side of theN-type semiconductor substrate 101) in a Z-direction in FIG. 8(direction of thickness of the N-type semiconductor substrate 101).Incidentally, the depth of the diffusion isolation region section 60(thickness in the Z-direction in FIG. 8 of the diffusion isolationregion section 60) is not limited to the example shown in FIG. 8, butmay be set arbitrarily as long as the diffusion isolation region section60 has such a depth as to be able to sufficiently separate thephotoelectric conversion sections 10 adjacent to each other in anX-direction in FIG. 8.

When the photoelectric conversion sections 10 adjacent to each other inthe X-direction in FIG. 8 are separated from each other by diffusionisolation as in the present embodiment, the width of the region forseparating the photoelectric conversion sections 10 from each other canbe narrower than in a case where the photoelectric conversion sections10 adjacent to each other are separated from each other by elementisolation by a method of LOCOS or STI, for example.

In addition, in the present embodiment, the second P-type well 52 havingan impurity concentration P2 higher than that of the first P-type well51 is disposed in the lower part of the element isolation region section40 formed between the photoelectric conversion section 10 and thesource/drain region section 30. Thus, similar effects to those of theforegoing first embodiment are obtained.

Incidentally, in the present embodiment, description has been made of anexample in which the diffusion isolation region section 60 is providedto the solid-state imaging device 100 according to the foregoing firstembodiment. However, the present disclosure is not limited to this. Thediffusion isolation region section 60 may be provided in a regionbetween photoelectric conversion sections 10 adjacent to each other inthe solid-state imaging device 110 according to the foregoing secondembodiment.

<4. Fourth Embodiment>

In a fourth embodiment, description will be made of an example in whicha second P-type well formed in a region between a photoelectricconversion section 10 and a source/drain region section 30 is disposedwithin the region of a first P-type well on which the source/drainregion section 30 is formed. Incidentally, the constitution of thepresent embodiment is suitable for uses in which sufficient pixelcharacteristics such as sensitivity, for example, can be secured evenwhen a pitch between pixels 1 is relatively increased.

FIG. 9 and FIG. 10 show a schematic constitution of parts in thevicinity of a photoelectric conversion section 10 in a solid-stateimaging device according to a fourth embodiment. Incidentally, FIG. 9 isa schematic diagram of an arrangement of the parts in the vicinity ofthe photoelectric conversion section 10 in a light receiving surface ofthe solid-state imaging device 130 according to the present embodiment(in an XY plane in FIG. 9). FIG. 10 is a sectional view taken along aline E-E of FIG. 9. In the solid-state imaging device 130 according tothe present embodiment shown in FIG. 9 and FIG. 10, similar constituentelements to those of the solid-state imaging device 100 according to theforegoing first embodiment shown in FIG. 2 and FIG. 3 are identified bythe same reference numerals.

(1) Constitution of Solid-State Imaging Device

The solid-state imaging device 130 includes an N-type semiconductorsubstrate 101 and a P-type epitaxial layer 102 formed on the N-typesemiconductor substrate 101, as in the foregoing first embodiment. Thesolid-state imaging device 130 also includes a photoelectric conversionsection 10 and a first P-type well 61, the photoelectric conversionsection 10 and the first P-type well 61 being formed on the P-typeepitaxial layer 102.

The solid-state imaging device 130 further includes a charge-to-voltageconverting section 20, a source/drain region section 30 of an NMOStransistor, and a second P-type well 62, the charge-to-voltageconverting section 20, the source/drain region section 30, and thesecond P-type well 62 being formed on the first P-type well 61. Thesolid-state imaging device 130 also includes an element isolation regionsection 40 disposed between the photoelectric conversion section 10 andthe source/drain region section 30, as in the foregoing firstembodiment. Incidentally, the source/drain region section 30 shown inFIG. 9 and FIG. 10 is the source/drain region section of the amplifyingsection 13 in FIG. 1.

As is clear from comparison between FIG. 9 and FIG. 2, the arrangementand constitution of the photoelectric conversion section 10, thecharge-to-voltage converting section 20, the source/drain region section30, and the element isolation region section 40 in the light receivingsurface of the solid-state imaging device 130 (in the XY plane in FIG.9) are similar to those of the foregoing first embodiment.

In addition, as is clear from comparison between FIG. 10 and FIG. 3, theconstitution of the present embodiment is similar to the constitution(FIG. 3) of the foregoing first embodiment except that the second P-typewell 62 is formed within the first P-type well 61 in the lower part(region on the side of the N-type semiconductor substrate 101) of theelement isolation region section 40.

That is, the solid-state imaging device 130 according to the presentembodiment has a constitution obtained by forming the second P-type well52 within the first P-type well 51 in the solid-state imaging device 100according to the foregoing first embodiment. The other constitution issimilar to the constitution of the foregoing first embodiment.Description in the following will therefore be made only of aconstitution of the second P-type well 62 and the vicinity thereof, thatis, an internal constitution of the lower part of the element isolationregion section 40.

(2) Constitution of Lower Part of Element Isolation Region Section(Constitution of Second P-Type Well)

In the present embodiment, as shown in FIG. 10, the second P-type well62 is disposed in the lower part of the element isolation region section40 (region between the photoelectric conversion section 10 and thesource/drain region section 30) and within the region of the firstP-type well 61. In addition, in the present embodiment, as in theforegoing first embodiment, the second P-type well 62 is formed so as tosurround the periphery of the source/drain region section 30.Incidentally, the present disclosure is not limited to this. It sufficesto provide the second P-type well 62 at least in the region between thephotoelectric conversion section 10 and the source/drain region section30.

Incidentally, the impurity concentration P2 of the second P-type well 62is set higher than the impurity concentration P1 of the first P-typewell 61 (P1<P2), as in the foregoing first embodiment. In addition, thedepth of the second P-type well 62 can be set in a similar manner to thedepth of the second P-type well 52 in the foregoing first embodiment.

When the second P-type well 62 is formed within the first P-type well 61as in the present embodiment, a part of the region of the first P-typewell 61 is disposed in a region between the second P-type well 62 andthe photoelectric conversion section 10. That is, in the presentembodiment, regions of the first P-type well 61, the second P-type well62, and the first P-type well 61 are arranged in this order from thesource/drain region section 30 to the photoelectric conversion section10 in the region between the source/drain region section 30 and thephotoelectric conversion section 10. Thereby, a concentration profile inwhich impurity concentration changes in order of P1 (low concentration),P2 (high concentration), and P1 (low concentration) from thesource/drain region section 30 to the photoelectric conversion section10 is formed in the region between the source/drain region section 30and the photoelectric conversion section 10.

As a result, also in the present embodiment, a barrier for carriersoccurring in the lower part of the source/drain region section 30 isformed in the region between the source/drain region section 30 and thephotoelectric conversion section 10. Thus, as with the foregoing firstembodiment, the present embodiment can suppress the outflow of carriersoccurring in the lower part of the source/drain region section 30 to thephotoelectric conversion section 10, and thereby suppress dark current.

Incidentally, in the present embodiment, description has been made of anexample in which the constitution having the second P-type well 62within the region of the first P-type well 61 is applied to thesolid-state imaging device 100 according to the foregoing firstembodiment. However, the present disclosure is not limited to this. Forexample, the above-described constitution of the second P-type well 62in the present embodiment may be applied to the solid-state imagingdevice according to the foregoing second embodiment or the foregoingthird embodiment. In addition, all of the constitutions described in theforegoing second to fourth embodiments may be applied to the solid-stateimaging device according to the foregoing first embodiment.

Description has been made of an example in which the solid-state imagingdevices according to the foregoing first to fourth embodiments have thesecond P-type well in the region between the source/drain region sectionof the NMOS transistor of the amplifying section 13 and thephotoelectric conversion section forming the pixel 1 shown in FIG. 1.However, the present disclosure is not limited to this. For example, thesecond P-type well may be provided not only to the amplifying section 13but also to a region between the source/drain region section of the NMOStransistor of the reset section 12 and/or the selecting section 14 andthe photoelectric conversion section.

In addition, all of the conductivity types (the P-type and the N-type)of carriers in the respective parts in the solid-state imaging devicesaccording to the foregoing first to fourth embodiments may be reversed.

Incidentally, the present disclosure can also adopt the followingconstitutions.

(1) A solid-state imaging device including:

a substrate;

a photoelectric conversion section configured to convert incident lightinto a signal charge, the photoelectric conversion section beingdisposed on the substrate and including an impurity region having acarrier polarity of a first conductivity type;

a first impurity layer being disposed on the substrate, having a carrierpolarity of a second conductivity type opposite from the firstconductivity type, and having a first impurity concentration;

a charge-to-voltage converting section configured to convert the signalcharge converted by the photoelectric conversion section into voltage,the charge-to-voltage converting section being disposed on the firstimpurity layer and including an impurity region having a carrierpolarity of the first conductivity type;

an amplifying section configured to amplify the voltage converted by thecharge-to-voltage converting section, the amplifying section beingdisposed on the first impurity layer and including a source/drain regionhaving a carrier polarity of the first conductivity type; and

a second impurity layer disposed in a region between the photoelectricconversion section and the amplifying section, having a carrier polarityof the second conductivity type, and having a second impurityconcentration higher than the first impurity concentration.

(2) The solid-state imaging device according to (1), further including:

a transfer section configured to transfer the signal charge from thephotoelectric conversion section to the charge-to-voltage convertingsection, the transfer section being disposed in a region between thephotoelectric conversion section and the charge-to-voltage convertingsection; and

a third impurity layer disposed in a region of the transfer section on aside of the substrate, having a carrier polarity of the secondconductivity type, and having a third impurity concentration higher thanthe first impurity concentration and equal to or lower than the secondimpurity concentration.

(3) The solid-state imaging device according to (2),

wherein a distance between a surface of the third impurity layer on theside of the substrate and the substrate in a direction of thickness ofthe substrate is equal to or more than a distance between a surface ofthe first impurity layer on the side of the substrate and the substratein the direction of thickness of the substrate.

(4) The solid-state imaging device according to one of (1) to (3),

wherein a distance between a surface of the second impurity layer on aside of the substrate and the substrate in a direction of thickness ofthe substrate is equal to or more than a distance between a surface ofthe first impurity layer on the side of the substrate and the substratein the direction of thickness of the substrate.

(5) The solid-state imaging device according to one of (1) to (4),further including an element isolation layer formed by a technique ofone of LOCOS and STI between the photoelectric conversion section andthe amplifying section.

(6) The solid-state imaging device according to one of (1) to (5),further including:

a plurality of the photoelectric conversion sections arranged in apredetermined direction; and

a diffusion isolation layer formed by a technique of diffusion isolationin a region between the photoelectric conversion sections adjacent toeach other in the predetermined direction.

(7) The solid-state imaging device according to one of (1) to (6),

wherein the second impurity layer is disposed within the first impuritylayer.

(8) The solid-state imaging device according to one of (1) to (7),

wherein the first conductivity type is an N-type, and the secondconductivity type is a P-type.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A device, comprising: a substrate; a firstphotoelectric conversion section on or above the substrate, wherein thefirst photoelectric conversion section includes a first impurity regionof a first conductivity type; a first impurity layer on or above thesubstrate, wherein the first impurity layer has a second conductivitytype opposite to the first conductivity type; a floating diffusionsection; a transfer section between the first photoelectric conversionsection and the floating diffusion section; an amplifying sectionconfigured to amplify a voltage from the floating diffusion section; andan element isolation region that at least partially surrounds theamplifying section.
 2. The device according to claim 1, furthercomprising a second impurity layer on or above the substrate, whereinthe second impurity layer has the second conductivity type, wherein thesecond impurity layer is below the element isolation region, and whereinthe first impurity layer has a first impurity concentration and thesecond impurity layer has a second impurity concentration different fromthe first impurity concentration.
 3. The device according to claim 2,wherein the first impurity concentration is higher than the secondimpurity concentration.
 4. The device according to claim 1, furthercomprising a selection section configured to control readout of theamplifying section, wherein the selection section is at least partiallysurrounded by the element isolation region.
 5. The device according toclaim 4, further comprising: a second photoelectric conversion sectionconfigured to convert incident light into a signal charge, wherein thesecond photoelectric conversion section is on or above the substrate,and wherein the second photoelectric conversion section includes asecond impurity region of the first conductivity type; and a secondtransfer section between the second photoelectric conversion section andthe floating diffusion section, wherein the second transfer section isconfigured to transfer the signal charge from the second photoelectricconversion section to the floating diffusion section.
 6. The deviceaccording to claim 1, further comprising: a reset section configured toreset the floating diffusion section, wherein the reset section ispartially surrounded by the element isolation region.
 7. The deviceaccording to claim 2, further comprising: a third impurity layer on orabove the substrate between the floating diffusion section and the firstphotoelectric conversion section, wherein the third impurity layer hasthe second conductivity type, wherein the amplifying section is abovethe second impurity layer, and wherein the third impurity layer has athird impurity concentration different from the second impurityconcentration.
 8. The device according to claim 7, wherein the secondimpurity concentration is higher than the third impurity concentration.9. The device according to claim 2, wherein the second impurity layer iswithin the first impurity layer.
 10. The device according to claim 1,wherein the element isolation region includes Shallow Trench Isolation(STI).
 11. The device according to claim 1, wherein the firstconductivity type is an N-type, and the second conductivity type is aP-type.
 12. The device according to claim 1, wherein the firstphotoelectric conversion section is coupled to the transfer section, thetransfer section is coupled to the floating diffusion section, thefloating diffusion section is coupled to a reset section and theamplifying section, and the reset section and the amplifying section arecommonly coupled to a voltage source.
 13. The device according to claim12, wherein a voltage source line coupled to the voltage source extendsin a horizontal direction.